This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Qorvo US, Inc.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations by Xiaokang Huang in Microelectronics Packaging
Introduction
Xiaokang Huang is a notable inventor based in Plano, TX (US). He has made significant contributions to the field of microelectronics, particularly in improving the reliability of solder joints in electronic packages. His innovative work has led to the development of a patented technology that addresses common issues in microelectronics packaging.
Latest Patents
Xiaokang Huang holds a patent for "Delamination/cracking improvement at solder joints in microelectronics package." This patent focuses on a microelectronics package designed to significantly reduce delamination and cracking at solder joints. The invention includes a carrier, a solder joint region, a top intermetallic (IMC) layer, and a device die. The device die features a substrate, an active device, a top barrier layer, and a backside metal layer made of gold (Au) with a thickness of at least 0.5 μm. The top IMC layer can comprise gold nickel tin (AuNiSn) or gold platinum tin (AuPtSn), while the solder joint region consists of an Au-rich gold-tin (AuSn) and gold-tin (AuSn) eutectic mixture. This innovative design enhances the durability and performance of microelectronics packages.
Career Highlights
Xiaokang Huang is currently employed at Qorvo US, Inc., where he continues to advance his research and development efforts in microelectronics. His work has been instrumental in enhancing the reliability of electronic devices, making them more efficient and durable.
Collaborations
Throughout his career, Xiaokang has collaborated with talented professionals, including Yinbao Yang and Kenneth Frazee. These collaborations have fostered a productive environment for innovation and have contributed to the success of their projects.
Conclusion
Xiaokang Huang's contributions to microelectronics packaging through his patented innovations demonstrate his expertise and commitment to advancing technology in this field. His work not only addresses critical challenges but also paves the way for future advancements in microelectronics.