Shanghai, China

Xiaokai Zhou

This inventor holds 1 USPTO granted patent. Top assignee: Ansys, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xiaokai Zhou. Retrieved from https://idiyas.com/inventor/xiaokai-zhou-ao6vlif2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Xiaokai Zhou and Adaptive Mesh Refinement for Three-Dimensional Stacked Models.

Introduction

Xiaokai Zhou is an inventor based in Shanghai, China, associated with Ansys, Inc. His patent work addresses adaptive mesh refinement for simulations of three-dimensional integrated circuits, where accurate modeling of stacked layers is important.

Latest Patents

Zhou is associated with 1 patent: “Adaptive Mesh Refinement Techniques for Three-Dimensional Stacked Models.” The patent describes a computer-implemented method that generates meshes for layers in a stacked model representing a 3D integrated circuit and runs simulations using those meshes. It calculates an interpolated value for a grid node, compares that value with a simulated value obtained using a second mesh, and uses the comparison to generate a refined mesh. This approach supports iterative refinement of the model’s grid based on simulation results.

Career Highlights

Zhou’s listed invention focuses on computational techniques for modeling and simulating complex, layered electronic structures. His work connects mesh generation, simulation, and value comparison to guide refinement of a model’s grid.

Collaborations

Zhou is associated with Ansys, Inc. His listed coworker is Huangjin Zhao.

Conclusion

Xiaokai Zhou’s patent describes a simulation-driven method for refining meshes in three-dimensional integrated-circuit models, highlighting his contribution to computational modeling technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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