Xiaofu Wei

Title: Innovations of Xiaofu Wei in Metal-Semiconductor Contact Structures

Introduction

Xiaofu Wei is a prominent inventor based in Beijing, China. He has made significant contributions to the field of semiconductor technology. His innovative work focuses on the development of advanced metal-semiconductor contact structures.

Latest Patents

Xiaofu Wei holds a patent for a "Metal-semiconductor contact structure based on two-dimensional semimetal electrodes." This patent discloses a unique metal-semiconductor contact structure that includes a semiconductor module and a metal electrode module. The semiconductor module is composed of a two-dimensional (2D) semiconductor material, while the metal electrode module utilizes a 2D semimetal material that features no dangling bonds on its surface. The interface between the 2D semiconductor material and the 2D semimetal material is characterized by a Van der Waals interface with a surface roughness of 0.01-1 nanometer (nm) and a spacing of less than 1 nm.

Career Highlights

Xiaofu Wei is affiliated with the University of Science and Technology Beijing, where he continues to advance his research in semiconductor technologies. His work has garnered attention for its potential applications in various electronic devices.

Collaborations

Xiaofu Wei collaborates with notable colleagues, including Yue Hua Zhang and Xiankun Zhang. Their combined expertise contributes to the innovative research being conducted at their institution.

Conclusion

Xiaofu Wei's contributions to the field of semiconductor technology, particularly through his patented innovations, highlight his role as a leading inventor in this domain. His work continues to influence advancements in electronic materials and structures.