Xiaofeng Deng

Title: Innovations of Xiaofeng Deng in Semiconductor Packaging

Introduction

Xiaofeng Deng is a notable inventor based in Zhuhai, China. He has made significant contributions to the field of semiconductor packaging. His innovative work focuses on enhancing chip interconnection technologies.

Latest Patents

Xiaofeng Deng holds a patent for a "Packaging structure for realizing chip interconnection and manufacturing method thereof." This patent describes a packaging structure that includes a core layer, a bridging layer, a first dielectric layer, a second dielectric layer, a first bonding pad layer, and a second bonding pad layer. The first dielectric layer is positioned between the core layer and the first bonding pad layer, while the second dielectric layer is situated between the second bonding pad layer and the core layer. The first bonding pad layer connects with the core layer through a first via, and the second bonding pad layer connects through a second via. The bridging layer is embedded within the first dielectric layer and is electrically insulated from the core layer. It connects with the first bonding pad layer via a third via. Xiaofeng Deng has 1 patent to his name.

Career Highlights

Xiaofeng Deng is currently employed at Zhuhai Yuexin Semiconductor Limited Liability Company. His role at the company allows him to apply his expertise in semiconductor technologies and contribute to advancements in the industry.

Collaborations

Xiaofeng Deng collaborates with Yejie Hong, who is also involved in semiconductor research and development. Their partnership enhances the innovative capabilities of their projects.

Conclusion

Xiaofeng Deng's contributions to semiconductor packaging technology demonstrate his commitment to innovation in the field. His patent reflects a significant advancement in chip interconnection methods, showcasing his expertise and dedication to improving semiconductor technologies.