Xiaodong Yang

Title: Xiaodong Yang: Innovator in PVD Technology

Introduction

Xiaodong Yang is a prominent inventor based in Xi'an, China. He has made significant contributions to the field of physical vapor deposition (PVD) technology. With a total of 3 patents, his work focuses on enhancing the efficiency and uniformity of film deposition processes.

Latest Patents

One of his latest patents is titled "Tilted magnetron in a PVD sputtering deposition chamber." This invention involves a chamber that includes a target and a magnetron positioned over the target. The magnetron features a plurality of magnets, with its longitudinal dimension tilted relative to the target. This design allows for varying distances between the magnets and the target, leading to uniform film properties and target erosion as the magnetron rotates during operation.

Another notable patent is "Methods and apparatus for zone control of RF bias for stress uniformity." This invention provides methods and apparatus for adjusting film stress profiles on substrates. The apparatus includes a PVD chamber with a pedestal supporting a substrate and a cover with multiple electrodes. The substrate stress profile tuner is designed to independently adjust the RF voltage levels of the electrodes, resulting in a more uniform film stress profile.

Career Highlights

Xiaodong Yang is currently employed at Applied Materials, Inc., a leading company in the semiconductor and display industries. His work at Applied Materials has allowed him to apply his innovative ideas in real-world applications, contributing to advancements in PVD technology.

Collaborations

Throughout his career, Xiaodong has collaborated with notable colleagues, including Lizhong Sun and Yi Yang. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Xiaodong Yang's contributions to PVD technology through his patents and work at Applied Materials, Inc. highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of film deposition processes.