This inventor holds 6 USPTO granted patents and 1 published patent application. Top assignees: Shanghai Kaihong Technology Co., Ltd., Hangzhou Silergy Semiconductor Technology Ltd, Silergy Semiconductor Technology (Hangzhou) Ltd. Active years: 2009-2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
4 out of 7 
1 out of 2 
1 out of 644 Years Active: 2009-2014
Title: Innovator XiaoChun Tan: Pioneering Chip Packaging Technology in Shanghai
Introduction
XiaoChun Tan is a notable inventor based in Shanghai, China, with an impressive record of innovation. With six patents to his name, Tan has made significant contributions to the field of semiconductor technology, particularly in developing advanced chip packaging solutions.
Latest Patents
One of Tan's latest patents is focused on a chip package structure and the method of making the same. This invention discloses methods and structures related to packaging a chip effectively. In one embodiment of his design, the chip package structure includes: (i) a chip featuring a plurality of first and second contact pads; (ii) a lead frame that contains several pins for external connection, supporting the placement of the chip; (iii) a number of first bonding wires connecting the first contact pads to the lead frame; and (iv) a plurality of second bonding wires linking the second contact pads to the pins on the lead frame. This innovative approach to chip packaging enhances both reliability and performance in semiconductor applications.
Career Highlights
Throughout his career, Tan has worked with prominent companies in the semiconductor industry, including Shanghai Kaihong Technology Co., Ltd. and Silergy Semiconductor Technology (Hangzhou) Ltd. His roles in these organizations have positioned him at the forefront of chip packaging technology research and development.
Collaborations
Tan has collaborated with esteemed colleagues, including Wei P. Chen and Jun Tao Guo, reinforcing the importance of teamwork and collaboration in innovative endeavors. These professional relationships have allowed for the exchange of ideas and expertise, driving the advancement of their shared technical objectives.
Conclusion
XiaoChun Tan continues to be a driving force in the realm of chip packaging technology, with a commitment to innovation that is evident in his patents and collaborations. His work not only exemplifies the spirit of ingenuity but also contributes to the advancement of the semiconductor industry in China and beyond.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile