The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Aug. 17, 2012
Applicants:
Wei Chen, Saratoga, CA (US);
Xiaochun Tan, Shanghai, CN;
Inventors:
Wei Chen, Saratoga, CA (US);
XiaoChun Tan, Shanghai, CN;
Assignee:
Silergy Semiconductor Technology (Hangzhou) Ltd., Hangzhou, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01005 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/01028 (2013.01); H01L 24/49 (2013.01); H01L 2924/01075 (2013.01); H01L 2224/85447 (2013.01); H01L 23/4952 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/01014 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/4917 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/014 (2013.01); H01L 24/48 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01033 (2013.01);
Abstract
Methods and structures related to packaging a chip are disclosed. In one embodiment, a chip package structure includes: (i) a chip having a plurality of first and second contact pads thereon; (ii) a lead frame having a plurality of pins for external connection to the package structure, where the chip is disposed on the lead frame; (iii) a plurality of first bonding wires for connecting the first contact pads to the lead frame; and (iv) a plurality of second bonding wires for connecting the second contact pads to the plurality of pins on the lead frame.