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Forward Citations = 48

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7 inventors (with patents filed for the assignee):

XiaoChun Tan (4 out of 6 patents)

Tan Xiaochun (3 out of 8 patents)

Li Yunfang (3 out of 3 patents)

4. Zhining Li (2 out of 6 patents)

5. Jun Tao Guo (2 out of 4 patents)

6. Xaiolan Jiang (1 out of 1 patent)

7. Xiaolan Jiang (1 out of 1 patent)

7 patents: Sort by Forward Citations

1. 8008128 - Thin quad flat package with no leads (QFN) fabrication methods (2011-08-30),

2. 7834433 - Semiconductor power device (2010-11-16),

3. 7745261 - Chip scale package fabrication methods (2010-06-29),

4. 7713784 - Thin quad flat package with no leads (QFN) fabrication methods (2010-05-11),

5. 7682874 - Chip scale package (CSP) assembly apparatus and method (2010-03-23),

6. 7517726 - Wire bonded chip scale package fabrication methods (2009-04-14),

7. 7402459 - Quad flat no-lead (QFN) chip package assembly apparatus and method (2008-07-22),

Shanghai Kaihong Technology Co., Ltd. is a leading provider of innovative technology solutions in the fields of automation, robotics, and intelligent manufacturing. With a focus on quality and reliability, we offer a wide range of products and services to meet the diverse needs of our clients. Our team of skilled professionals is dedicated to delivering cutting-edge solutions that help enhance efficiency, productivity, and profitability for businesses in various industries.

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USPTO Data Jan 1 1976 - Dec 2 2025

7 Patents

#296 in Shanghai

#3,390 in China

Shanghai, China

Shanghai Kaihong Technology Co., Ltd.