Li Yunfang

Title: Innovations of Li Yunfang in Semiconductor Technology

Introduction

Li Yunfang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology. With a total of 3 patents to his name, his work focuses on improving the efficiency and manufacturing processes of semiconductor devices.

Latest Patents

One of Li Yunfang's latest patents is a semiconductor power device. This invention includes a single gauge lead frame, a semiconductor die, and a heat sink. The semiconductor die is attached to a first level of the lead frame, while the heat sink is attached to a second level. A molding compound encapsulates the semiconductor die and a portion of the lead frame, allowing for efficient manufacturing compared to dual gauge lead frame devices.

Another notable patent is a chip scale package (CSP) assembly apparatus and method. This method involves forming conductive bumps on a semiconductor wafer, mounting it on adhesive tape, and sawing the wafer to obtain CSPs. This innovative approach has improved efficiency compared to many existing methods of fabricating CSPs.

Career Highlights

Li Yunfang works at Shanghai Kaihong Technology Co., Ltd., where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise and innovative mindset have positioned him as a key player in his field.

Collaborations

Li collaborates with Tan Xiaochun, a talented coworker who contributes to their shared projects and innovations.

Conclusion

Li Yunfang's contributions to semiconductor technology through his patents demonstrate his commitment to innovation and efficiency. His work continues to influence the industry and pave the way for future advancements.