Kunshan, China

Xiaobiao Dong

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Chengdu Vistar Optoelectronics Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xiaobiao Dong. Retrieved from https://idiyas.com/inventor/xiaobiao-dong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations of Xiaobiao Dong in Micro-Light Emitting Diode Technology

Introduction

Xiaobiao Dong is a prominent inventor based in Kunshan, China. He has made significant contributions to the field of micro-light emitting diode (LED) technology. His innovative approach has led to the development of a unique bonding method that enhances the efficiency and reliability of micro-LED chips.

Latest Patents

Xiaobiao Dong holds a patent for a bonding method of a micro-light emitting diode chip. This method involves several key steps, including the formation of solder columns on the electrodes of each chip bonding area and the creation of a glue layer that facilitates the adhesion of the chip to the backplane. The process ensures that the positive and negative electrodes of the chip are properly aligned and securely bonded, resulting in improved performance of the micro-LEDs.

Career Highlights

Xiaobiao Dong is currently associated with Chengdu Vistar Optoelectronics Co., Ltd. His work at this company focuses on advancing micro-LED technology, which has applications in various fields, including display technology and lighting solutions. His innovative methods have positioned him as a key player in the optoelectronics industry.

Conclusion

Xiaobiao Dong's contributions to micro-light emitting diode technology exemplify the impact of innovative thinking in the field of optoelectronics. His patented bonding method represents a significant advancement that could influence future developments in LED technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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