The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 10, 2025
Filed:
Jul. 29, 2021
Chengdu Vistar Optoelectronics Co., Ltd., Sichuan, CN;
Xiaobiao Dong, Kunshan, CN;
Chengdu Vistar Optoelectronics Co., Ltd., Chengdu, CN;
Abstract
The bonding method of a micro-light emitting diode chip includes providing a backplane, and two solder columns are formed on electrodes of each chip bonding area of the backplane; forming a glue groove in the chip bonding area, forming a glue layer in the glue groove to make the glue layer cover tops of the solder columns; moving the chip to make positive and negative electrodes of the chip aligned with the two solder columns respectively; heating the backplane to make the glue layer melt into liquid glue; making positive and negative electrodes of the chip immersed in the liquid glue; after cooling to a room temperature, making the positive electrode and the negative electrode of the chip adhered to the two solder columns respectively; removing a transfer head; soldering the positive electrode and the solder column adhered together, and the negative electrode and the solder column adhered together.