Company Filing History:
Years Active: 2020-2022
Title: Innovations of Inventor Xiao Jin Wang
Introduction
Xiao Jin Wang is a notable inventor based in Hubei, China. He has made significant contributions to the field of wafer bonding technology. With a total of 2 patents, his work has garnered attention in the industry.
Latest Patents
Xiao Jin Wang's latest patents focus on a wafer bonding method and the structures associated with it. The disclosed embodiments detail a process that includes performing a plasma activation treatment on the front surfaces of two wafers. Following this, a silica sol treatment is applied to enhance the bonding surfaces. A preliminary bonding process is then executed, culminating in a heat treatment that effectively bonds the two wafers together.
Career Highlights
Xiao Jin Wang is currently employed at Yangtze Memory Technologies Co., Ltd. His role at the company allows him to apply his innovative ideas in a practical setting, contributing to advancements in memory technology.
Collaborations
He collaborates with talented coworkers, including Shuai Guo and Jia Wen Wang, who contribute to the innovative environment at Yangtze Memory Technologies Co., Ltd.
Conclusion
Xiao Jin Wang's contributions to wafer bonding technology exemplify the impact of innovation in the field. His patents reflect a commitment to advancing technology and improving manufacturing processes.