This inventor holds 1 USPTO granted patent. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Innovations by Inventor Xiao Gu
Introduction
Xiao Gu is a notable inventor based in JiangSu, China. He has made significant contributions to the field of semiconductor devices. His innovative work focuses on optimizing thermal performance in multi-chip modules.
Latest Patents
Xiao Gu holds a patent titled "Power envelope analysis for the thermal optimization of multi-chip modules." This patent involves a method for calculating a thermal resistance matrix for semiconductor devices. It includes selecting maximum junction temperatures for multiple dies and calculating power envelope surfaces based on these parameters. The invention aims to compare selected power levels against these surfaces to determine risk values, enhancing the reliability of semiconductor devices.
Career Highlights
Xiao Gu is currently employed at Stats Chippac Pte. Ltd., where he applies his expertise in semiconductor technology. His work has contributed to advancements in the efficiency and performance of electronic components.
Collaborations
Xiao Gu collaborates with Yonghyuk Jeong, a talented woman in the field, to further enhance their research and development efforts.
Conclusion
Xiao Gu's innovative approach to thermal optimization in semiconductor devices showcases his commitment to advancing technology. His contributions are vital in improving the performance and reliability of multi-chip modules.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile