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For the Inventor, By the Inventor

Shenzhen, China

Xiao-Feng Ma

This inventor holds 21 USPTO granted patents and 31 published patent applications, primarily in Heat Dissipation Technology. Top assignees: Hon Hai Precision Industry Co., Ltd., Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd., Hong Fu Jin Precision Industry Co., Ltd.. Active years: 2010-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xiao-Feng Ma. Retrieved from https://idiyas.com/inventor/xiao-feng-ma

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 

% Patents Active = 9.5

Average Co-Inventor Count = 1.9

ph-index = 5

Forward Citations = 82(Granted Patents)


Company Filing History:

goldMedal20 out of 19,792 
 
Hon Hai Precision Industry Co., Ltd.
 patents
silverMedal19 out of 4,047 
 
Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd.
 patents
bronzeMedal1 out of 9 
 
Hong Fu Jin Precision Industry Co., Ltd.
 patents
4. 1 out of 56 
 
Zhongshan Innocloud Intellectual Property Services Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2010-2015

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Areas of Expertise:
Heat Sink Assembly
Airflow Guide
Heat Dissipation Device
Environmental Testing
Memory Card Mounting
Electrical Plug Fastener
Cable Clamp
Heated Keyboard
Computer System
Thermal Management
Fixing Device
Jumper Device
21 patents (USPTO):Explore Patents
1. 9063709 - Fan assembly (2015-06-23),
2. 8926348 - Mounting apparatus for memory card having a holding portion connected to a pivotally mounted fixing portion (2015-01-06),
3. 8724327 - Heat sink assembly (2014-05-13),
4. 8708644 - Fixing device for fan (2014-04-29),
5. 8602806 - Electrical plug fastener (2013-12-10),
6. 8567268 - Environmental testing device (2013-10-29),
7. 8550836 - Mounting apparatus for memory card (2013-10-08),
8. 8482923 - Heat sink clip with wire clip (2013-07-09),
9. 8477495 - Airflow guide member and electronic device having the same (2013-07-02),
10. 8381800 - Heat dissipation device with triangular guiding member (2013-02-26),
11. 8348607 - Heat dissipating device and bracket thereof (2013-01-08),
12. 8251757 - Cable clamp having a base with a tapered hole and a sleeve with a tapered outer wall to clamp a cable in-between (2012-08-28),
13. 8248781 - Computer system with waste heat recycling device (2012-08-21),
14. 8242412 - Heated keyboard (2012-08-14),
15. 8164888 - Computer (2012-04-24),

Title: The Innovative Journey of Inventor Xiao-Feng Ma

Introduction: Xiao-Feng Ma is a visionary inventor hailing from the bustling city of Shenzhen, China. His groundbreaking work in the field of technology has earned him recognition on both a national and international level.

Latest Patents: Xiao-Feng Ma holds several patents in the realm of artificial intelligence and robotics, showcasing his commitment to pushing the boundaries of innovation. His most recent patents focus on enhancing the efficiency and capabilities of autonomous systems.

Career Highlights: With a career spanning over two decades, Xiao-Feng Ma has worked tirelessly to transform his inventive ideas into tangible solutions. His dedication to research and development has led to the creation of cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Xiao-Feng Ma has collaborated with leading tech companies and research institutions to further his innovative projects. His ability to work in multidisciplinary teams has resulted in the successful implementation of groundbreaking technologies.

Conclusion: Xiao-Feng Ma's passion for innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the world of technology. His contributions continue to inspire future generations of inventors and shape the landscape of technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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