The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8724327 B1

PDF
Full Text
Expired
Date of Patent:
May. 13, 2014

Filed:

Apr. 25, 2012
Applicants:

Xiao-feng MA, Shenzhen, CN;

Lei Liu, Shenzhen, CN;

Inventors:

Xiao-Feng Ma, Shenzhen, CN;

Lei Liu, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat sink assembly includes a heat sink, two first fixing structures, and two second fixing structures. The heat sink includes a base. The base includes two opposite sidewalls each forming a fixing portion. When the heat sink is mounted to a first motherboard, the first fixing structures are respectively and detachably connected to the fixing portions of the heat sink, and fix the heat sink to the first motherboard. When the heat sink is mounted to a second motherboard, the second fixing structures are detachably connected to fixing portions of the heat sink, and fix the heat sink to the second motherboard.


Find Patent Forward Citations

Ma, Xiao-Feng. (2014). Heat sink assembly (U.S. Patent No. 8724327). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8724327

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…