This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 1998-2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1998-2002
Title: Innovations of Inventor Xiao Chun Mu
Introduction
Xiao Chun Mu is a notable inventor based in Saratoga, CA (US). He has made significant contributions to the field of integrated circuit packaging, holding 2 patents that showcase his innovative approaches.
Latest Patents
One of his latest patents is titled "Process for making active interposer for high performance packaging applications." This patent describes an integrated circuit (IC) package process that involves forming a via hole in a substrate, patterning signal lines, and electronically connecting multiple substrates. The process aims to enhance the performance and efficiency of IC packaging. Another significant patent is related to "High density plasma physical vapor deposition." This method involves forming a material in an opening on a substrate using a high-density plasma system, which is crucial for semiconductor manufacturing.
Career Highlights
Xiao Chun Mu is currently employed at Intel Corporation, where he continues to push the boundaries of technology and innovation. His work focuses on improving the efficiency and performance of electronic components through advanced packaging techniques.
Collaborations
He collaborates with talented individuals such as Larry E Mosley and Shu Jin, who contribute to his projects and innovations in the field.
Conclusion
Xiao Chun Mu's contributions to integrated circuit packaging and his innovative patents reflect his expertise and commitment to advancing technology. His work at Intel Corporation continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile