Xianlei Zhang

Title: Xianlei Zhang: Innovator in Metal Layer Deposition Technology

Introduction

Xianlei Zhang is a prominent inventor based in Fujian, China. He has made significant contributions to the field of semiconductor technology, particularly in the area of metal layer deposition on wafers. His innovative approach has led to the development of a unique method that enhances the efficiency and effectiveness of the deposition process.

Latest Patents

Xianlei Zhang holds a patent for a "Method for depositing a metal layer on a wafer." This patent describes a process involving a physical vapor deposition (PVD) chamber equipped with a wafer chuck, a target situated above the chuck, and a magnet positioned on the backside of the target. The method utilizes a DC power supply to apply voltage to the target, which is made of a ferromagnetic metal or alloy. The process includes a series of steps such as admitting a working gas into the chamber and igniting it in cascade stages, followed by loading the wafer and performing the deposition process to create a metal layer on the wafer.

Career Highlights

Xianlei Zhang is currently employed at United Semiconductor (Xiamen) Co., Ltd. His work at this company has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in semiconductor manufacturing. His expertise in the field has positioned him as a valuable asset to his team and the industry.

Collaborations

Xianlei Zhang collaborates with notable colleagues, including Xijun Guo and Jianhua Chen. Their combined efforts in research and development have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Xianlei Zhang's contributions to the field of semiconductor technology, particularly through his patented method for metal layer deposition, highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future advancements in semiconductor manufacturing.