Shanghai, China

Xiang Ye

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xiang Ye. Retrieved from https://idiyas.com/inventor/xiang-ye-fx171i1h

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Xiang Ye and Multi-Panel Computing Device Communication

Introduction

Xiang Ye is an inventor based in Shanghai, China, associated with Intel Corporation. His work includes a patented approach to communication between input/output devices and a processor in a multi-panel computing device.

Latest Patents

The provided information lists one patent for Ye: “Message conversion and message passthrough between devices and a processor in a multi-panel computing device.” The invention describes a processor in a device’s lid that receives messages from input/output devices using different communication protocols, converts them to a host communication protocol, and sends them across a bus through the hinge to the device’s base. The bus uses fewer wires than the connections serving the input/output devices, helping simplify communication across the hinge.

Career Highlights

Ye is associated with Intel Corporation, where his patent work concerns computing-device architecture and communication systems. The supplied information identifies 1 patent.

Collaborations

The provided data names Israel A. Cepeda Lopez as Ye’s coworker. It does not specify their roles or describe a particular joint project.

Conclusion

Xiang Ye’s listed patent addresses efficient message conversion and transmission in multi-panel computing devices, reflecting a focus on practical communication design for computer hardware.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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