Company Filing History:
Years Active: 2008
Title: **Wooi Aun Tan – Innovator in Semiconductor Technology**
Introduction
Wooi Aun Tan is a notable inventor based in Penang, Malaysia, recognized for his contributions to semiconductor package technology. With one patent to his name, he exemplifies the fusion of innovation and practical application in the tech industry.
Latest Patents
Tan holds a patent for a unique method of providing a metal layer in a semiconductor package. The patent outlines a semiconductor package that comprises a substrate, a semiconductor die featuring a first surface opposed to the substrate and a second surface, a metal layer positioned on the second surface of the semiconductor die, and a mold layer applied to the substrate. Notably, in some embodiments, the mold layer is designed to be substantially coplanar with the metal layer, enhancing overall package performance.
Career Highlights
Wooi Aun Tan is currently employed at Intel Corporation, a global leader in semiconductor manufacturing. His work contributes significantly to the advancement of semiconductor technologies, shaping the future of electronics.
Collaborations
During his career, Tan has collaborated with colleagues like Lee Peng Khaw and Chee Koang Chen. Together, they bring diverse expertise and insights that foster innovation and propel projects forward in their respective fields within Intel Corporation.
Conclusion
Wooi Aun Tan's inventive work in semiconductor packaging represents a significant step forward in technology. His dedication to improving package performance through innovative designs showcases the critical role inventors play in the ever-evolving tech landscape. Through his patent and collaborations, Tan continues to contribute to advancements that will benefit the industry for years to come.