The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Dec. 15, 2005
Lee Peng Khaw, Kedah, MY;
Chee Koang Chen, Penang, MY;
Wooi Aun Tan, Penang, MY;
Tze Yang Hin, Penang, MY;
Lee Peng Khaw, Kedah, MY;
Chee Koang Chen, Penang, MY;
Wooi Aun Tan, Penang, MY;
Tze Yang Hin, Penang, MY;
Intel Corporation, Santa Clara, CA (US);
Abstract
In one embodiment, the present invention includes a semiconductor package having a substrate, a semiconductor die with a first surface opposing the substrate and a second surface, a metal layer formed on the second surface of the semiconductor die, and a mold layer formed on the substrate. In some embodiments, the mold layer is substantially coplanar with the metal layer to improve package performance. Other embodiments are described and claimed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile