This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Woohyeong Kim: Innovator in Semiconductor Packaging
Introduction
Woohyeong Kim is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods.
Latest Patents
Woohyeong Kim holds a patent for a semiconductor package that features protrusions from a redistribution wiring layer. The patent, titled "Semiconductor package having protrusions from redistribution wiring layer and method of manufacturing the semiconductor package," describes a semiconductor package that includes a first redistribution wiring layer with protrusions and bonding pads. This design enhances the functionality and efficiency of semiconductor devices.
Career Highlights
Woohyeong Kim is currently employed at Samsung Electronics Ltd., a leading company in the technology sector. His work at Samsung has allowed him to be at the forefront of semiconductor innovation, contributing to the development of advanced packaging solutions.
Collaborations
Due to space constraints, the collaborations section will be omitted.
Conclusion
Woohyeong Kim's contributions to semiconductor packaging reflect his innovative spirit and technical expertise. His patent demonstrates the potential for advancements in the semiconductor industry, paving the way for future developments.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile