The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H10B 80/00 (2023.01);

U.S. Cl.

CPC ...

H01L 23/49811 (2013.01); H01L 21/4857 (2013.01); H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H10B 80/00 (2023.02);

Abstract

A semiconductor package includes a first redistribution wiring layer having a first surface and a second surface opposite to the first surface, the first redistribution wiring layer having protrusions protruding from the first surface and a plurality of first bonding pads provided on the protrusions, a first semiconductor device mounted on the first redistribution wiring layer via conductive bumps, a plurality of conductive structures respectively extending from the first bonding pads around the first semiconductor device, and a second redistribution wiring layer disposed on the conductive structures and electrically connected to the first redistribution wiring layer.

Find Patent Forward Citations

Yoo, Jaekyung. (2026). Semiconductor package having protrusions from redistribution wiring layer and method of manufacturing the semiconductor package (U.S. Patent No. 12628712). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12628712

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