Seoul, South Korea

Wonll Kwon


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2014-2016

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3 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Wonll Kwon

Introduction

Wonll Kwon is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology. With a total of 3 patents to his name, Kwon has demonstrated a commitment to advancing innovation in integrated circuit packaging systems.

Latest Patents

Kwon's latest patents include a semiconductor device and a method of forming a multi-layered UBM with an intermediate insulating buffer layer to reduce stress for semiconductor wafers. This invention involves a semiconductor wafer with a contact pad, where multiple insulating layers are strategically formed to enhance performance and reliability. Another notable patent is for an integrated circuit packaging system with coupling features and a method of manufacture. This patent outlines a process that includes forming a through silicon via and coupling features to improve electrical connections within the wafer substrate.

Career Highlights

Kwon is currently employed at Stats Chippac Pte. Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing innovative solutions that address the challenges faced in the industry.

Collaborations

Kwon has collaborated with talented coworkers such as DaeSik Choi and JoonYoung Choi. Their combined expertise has contributed to the successful development of advanced semiconductor technologies.

Conclusion

Wonll Kwon's contributions to the field of semiconductor technology are noteworthy and impactful. His innovative patents and collaborative efforts continue to shape the future of integrated circuit packaging systems.

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