The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Dec. 14, 2011
Applicants:
Minjung Kim, Kwang-ju, KR;
Daesik Choi, Seoul, KR;
Wonll Kwon, Seoul, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a wafer substrate having an active side containing a contact; forming a through silicon via extending through the wafer substrate electrically connected to the contact having a via width; forming a first coupling feature extending from a top side of the through silicon via; and forming a second coupling feature on the side of the through silicon via opposite the first coupling feature.