This inventor holds 1 USPTO granted patent. Top assignee: Litef Gmbh. Active years: 1990.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1990
Title: Wolfram Ebert: Innovator in Micromechanical Engineering
Introduction
Wolfram Ebert is a notable inventor based in Freiburg, Germany. He has made significant contributions to the field of micromechanical engineering, particularly with his innovative designs and patents. His work exemplifies the intersection of precision engineering and practical application.
Latest Patents
Wolfram Ebert holds a patent for a "Pendulum with bending spring joint." This invention features a micromechanical bending spring joint formed from selectively etched wafer material. The joint consists of a pair of leaf springs arranged alongside each other, inclined at an oblique angle to the opposed surfaces of the wafer. These springs cross to define a point of intersection, allowing for high precision in fulcrum position, bending spring constant, and transverse axis rigidity. Ebert's patent is a testament to his expertise and innovative thinking in the field, with a total of 1 patent to his name.
Career Highlights
Wolfram Ebert is currently employed at Litef GmbH, where he continues to push the boundaries of micromechanical technology. His work at Litef GmbH has allowed him to collaborate with other talented engineers and inventors, further enhancing his contributions to the industry.
Collaborations
Throughout his career, Ebert has worked alongside notable colleagues such as Bruno F. Ryrko and Martin Hafen. These collaborations have fostered an environment of innovation and creativity, leading to advancements in their respective fields.
Conclusion
Wolfram Ebert's contributions to micromechanical engineering, particularly through his patented inventions, highlight his role as a key innovator in the industry. His work continues to inspire future advancements in technology and engineering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
