The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 1990
Filed:
Jan. 20, 1988
Applicant:
Inventors:
Wolfram Ebert, Freiburg, DE;
Eberhard Handrich, Kirchzarten, DE;
Martin Hafen, Rottweil, DE;
Bruno Ryrko, Denslingen, DE;
Assignee:
Litef GmbH, Freiburg im Breisgau, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F16F / ;
U.S. Cl.
CPC ...
267160 ; 156647 ; 267150 ; 267158 ; 267182 ;
Abstract
A micromechanical bending spring joint is formed of selectively etched wafer material. The joint includes a pair of leaf springs arranged alongside each other. Each spring is inclined at an oblique angle to the opposed surfaces of the wafer and such springs cross to define a point of intersection. The joint, selectively etched from a single wafer, is characterized by high precision of fulcrum position, bending spring constant and transverse axis rigidity.