Wolfgang Dietze

This inventor holds 18 USPTO granted patents, primarily in Semiconductor Manufacturing. Top assignee: Siemens Aktiengesellschaft. Active years: 1976-1985.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wolfgang Dietze. Retrieved from https://idiyas.com/inventor/wolfgang-dietze

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 18

% Patents Active = 100.0

Average Co-Inventor Count = 1.9

ph-index = 7

Forward Citations = 134(Granted Patents)

Company Filing History:

18 out of 30,893

Siemens Aktiengesellschaft

patents

Years Active: 1976-1985

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Areas of Expertise:

Silicon Granulate

Semiconductor Material

Crystalline Deposition

Tubular Bodies

Wafer Rack Structures

Furnace Tapping

Hollow Bodies

Heatable Tubes

Disc Support Structures

Elemental Silicon

Manufacturing Processes

18 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 4532090 - Method and apparatus for the manufacture of high purity silicon granulate (1985-07-30),

2. 4475206 - Method and device for tapping a furnace containing a tappable melt (1984-10-02),

3. 4426408 - Method of deposition of silicon in fine crystalline form (1984-01-17),

4. 4345142 - Directly heatable semiconductor tubular bodies (1982-08-17),

5. 4255463 - Method of deposition of silicon in fine crystalline form (1981-03-10),

6. 4203940 - Crystal wafer rack structures and the method of producing the same (1980-05-20),

7. 4148931 - Process for depositing elemental silicon semiconductor material from a (1979-04-10),

8. 4125643 - Process for depositing elemental silicon semiconductor material from a (1978-11-14),

9. 4102298 - Device for deposition of semi-conductor material (1978-07-25),

10. 4093201 - Disc support structure (1978-06-06),

11. 4035460 - Shaped bodies and production of semiconductor material (1977-07-12),

12. 4034705 - Shaped bodies and production of semiconductor material (1977-07-12),

13. 4015922 - Apparatus for the manufacture of tubular bodies of semiconductor material (1977-04-05),

14. 4007369 - Tubular oven (1977-02-08),

15. 3979490 - Method for the manufacture of tubular bodies of semiconductor material (1976-09-07),

Title: Wolfgang Dietze: Innovator in Silicon Manufacturing

Introduction

Wolfgang Dietze is a prominent inventor based in Munich, Germany. He has made significant contributions to the field of silicon manufacturing, holding a total of 18 patents. His innovative approaches have advanced the methods used in producing high-purity silicon granulate.

Latest Patents

Among his latest patents is a method and apparatus for the manufacture of high purity silicon granulate. This invention involves the manufacture of silicon granules from molten silicon by pouring it into a liquid body, which solidifies and granulates the silicon. The liquid body is designed to be substantially free of impurities that could contaminate the silicon. Another notable patent is a method and device for tapping a furnace containing a tappable melt. This method allows for the tapping of a furnace that contains silicon dioxide to be reduced to silicon with carbon. It includes providing a graphite tap pipe on the furnace and electrically heating the tap pipe to facilitate the flow of liquid silicon.

Career Highlights

Wolfgang Dietze is currently employed at Siemens Aktiengesellschaft, where he continues to innovate in the field of silicon production. His work has been instrumental in enhancing the efficiency and purity of silicon manufacturing processes.

Collaborations

He has collaborated with notable colleagues such as Ulrich Rucha and Andreas Kasper, contributing to various projects that aim to improve silicon production techniques.

Conclusion

Wolfgang Dietze's contributions to silicon manufacturing through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in the production of high-purity silicon.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]