This inventor holds 2 USPTO granted patents. Top assignees: General Instrument Corporation of Delaware, General Semiconductor, Inc., Kras Asia Ltd.. Active years: 1997-2000.
Company Filing History:
1 out of 52 
1 out of 96 
1 out of 2 Years Active: 1997-2000
Title: Innovations by Wing Lun Wong in Injection Molding Technology.
Introduction
Wing Lun Wong is an accomplished inventor based in Hong Kong, China. He has made significant contributions to the field of injection molding, particularly in the manufacturing of semiconductor elements. With a total of two patents to his name, Wong's work showcases innovative methods and apparatuses that enhance the efficiency and effectiveness of injection molding processes.
Latest Patents
Wong's latest patents include a "Method of injection molding elements such as semiconductor elements" and an "Apparatus for the injection molding of semiconductor elements." The method patent outlines a multi-step process for charging a molding compound into an injection nozzle and injecting it into a mold cavity. This process involves the use of a mini-plunger to control the flow of the molding compound, ensuring that the compound is injected efficiently and that the mold can be separated before the material fully cures. The apparatus patent describes a specialized injection molding apparatus that connects directly to a mold, allowing for rapid curing of residual material and facilitating subsequent molding processes.
Career Highlights
Throughout his career, Wong has worked with notable companies such as General Instrument Corporation of Delaware and Kras Asia Ltd. His experience in these organizations has contributed to his expertise in injection molding technology and has allowed him to develop innovative solutions for the industry.
Collaborations
Wong has collaborated with several professionals in his field, including Eugene Chen and Hohn Jong Hsiung. These collaborations have likely enriched his work and contributed to the development of his patents.
Conclusion
Wing Lun Wong's contributions to injection molding technology demonstrate his innovative spirit and commitment to advancing manufacturing processes. His patents reflect a deep understanding of the complexities involved in molding semiconductor elements, positioning him as a key figure in this specialized field.