Wing-Bun Lee

Title: Wing-Bun Lee: Innovator in Ultra-Precision Freeform Surfaces

Introduction

Wing-Bun Lee is a distinguished inventor based in Hong Kong, CN. He has made significant contributions to the field of optical engineering, particularly in the development of methods for aligning ultra-precision freeform surfaces. His work is crucial for advancing technologies used in photonics and telecommunications.

Latest Patents

Wing-Bun Lee holds a patent titled "Methods and apparatus of aligning surfaces." This invention addresses the challenges associated with ultra-precision freeform surfaces, which are essential for complex micro-optical-electro-mechanical devices. These surfaces often exhibit geometrical complexities that make it difficult to assess their form accuracy and surface quality. The patented method utilizes a feature-point pre-fixture and an iterative precision alignment algorithm, enabling form characterization with accuracy levels below the sub-micrometer range.

Career Highlights

Wing-Bun Lee is affiliated with The Hong Kong Polytechnic University, where he has been instrumental in research and development related to optical technologies. His expertise in ultra-precision engineering has positioned him as a key figure in the academic and research community.

Collaborations

He has collaborated with notable colleagues, including Chi-Fai Cheung and Huifen Li, contributing to various projects that enhance the understanding and application of optical surfaces.

Conclusion

Wing-Bun Lee's innovative work in ultra-precision freeform surfaces exemplifies the intersection of engineering and technology. His contributions are vital for the advancement of optical devices used in modern telecommunications and photonics.