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For the Inventor, By the Inventor

Saratoga, CA, United States of America

William Y Hata

USPTO Granted Patents = 10

Average Co-Inventor Count = 1.2

ph-index = 3

Forward Citations = 41(Granted Patents)


Company Filing History:

goldMedal10 out of 4,287 
 
Altera Corporation
 patents

Years Active: 2005-2016

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10 patents (USPTO):Explore Patents
1. 9267985 - Bond and probe pad distribution (2016-02-23),
2. 9202772 - Heat pipe in overmolded flip chip package (2015-12-01),
3. 8772085 - Integrated circuit package architecture (2014-07-08),
4. 8148813 - Integrated circuit package architecture (2012-04-03),
5. 8003984 - Reticle for wafer test structure areas (2011-08-23),
6. 7316935 - Reticle for layout modification of wafer test structure areas (2008-01-08),
7. 7212032 - Method and apparatus for monitoring yield of integrated circuits (2007-05-01),
8. 6982566 - Method and apparatus for operating a burn-in board to achieve lower equilibrium temperature and to minimize thermal runaway (2006-01-03),
9. 6967111 - Techniques for reticle layout to modify wafer test structure area (2005-11-22),
10. 6956165 - Underfill for maximum flip chip package reliability (2005-10-18),

Title: The Innovative Contributions of William Y. Hata

Introduction

William Y. Hata is a prominent inventor based in Saratoga, CA (US), known for his significant contributions to the field of integrated circuits and semiconductor packaging. With a total of 10 patents to his name, Hata has made remarkable advancements that enhance the functionality and efficiency of electronic devices.

Latest Patents

Among his latest patents, Hata has developed a unique integrated circuit (IC) that features a plurality of bond pads and probe pads. This design allows for improved electrical communication between the bond pads and probe pads, which are strategically configured across the surface of the IC. In one embodiment, the probe pads are arranged diagonally, while in another, multiple rows of linearly disposed probe pads are utilized. Additionally, Hata has innovated a heat pipe in an overmolded flip chip package. This improvement involves a molded semiconductor package that includes a substrate, a semiconductor die, and a heat pipe that encircles the die, enhancing thermal management in semiconductor devices.

Career Highlights

William Y. Hata is currently associated with Altera Corporation, where he continues to push the boundaries of technology through his inventive work. His career is marked by a commitment to developing solutions that address the challenges faced in the semiconductor industry.

Collaborations

Hata has collaborated with notable colleagues, including Christopher J. Pass and Jayabrata Ghosh Dastidar, contributing to a dynamic environment of innovation and creativity.

Conclusion

William Y. Hata's contributions to the field of integrated circuits and semiconductor packaging exemplify the spirit of innovation. His patents not only reflect his expertise but also pave the way for future advancements in technology.

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