The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2011
Filed:
Dec. 05, 2007
William Y. Hata, Saratoga, CA (US);
William Y. Hata, Saratoga, CA (US);
Altera Corporation, San Jose, CA (US);
Abstract
Techniques are provided for forming die on wafers with large area test structures between primary die. A reticle is used to pattern each die. The pattern on the reticle forms a primary die and test structures in scribelines that abut edges of the die. A reticle can be used to form additional test structures that are separated from the primary die. A gap is formed between the additional test structures and the primary die in each exposure. In subsequent exposures, test structures for adjacent die are formed in the gaps between the previously formed primary die and their additional test structures. These techniques are used to provide larger test structure area between each primary die. A blade can be used to block portions of the reticle that form the additional test structures. The reticle can then be used to pattern die with smaller test structures during high volume chip production.