The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2015
Filed:
Feb. 28, 2013
Altera Corporation, San Jose, CA (US);
William Y. Hata, Saratoga, CA (US);
Altera Corporation, San Jose, CA (US);
Abstract
The present invention is an improvement in a molded semiconductor package and the method for its manufacture. The package comprises a substrate, a semiconductor die mounted on the substrate, a molding compound encircling the die on the substrate, a lid on the molding compound, and a heat pipe extending between the semiconductor die and the lid. Preferably, the heat pipe is formed so that it encircles the die. The package is assembled by mounting the die on the substrate, applying the molding compound to the substrate while a channel is formed in the molding compound adjacent the semiconductor die, inserting a heat pipe material in the channel, and mounting the lid on the molding compound and the heat pipe material.