IDiyas

For the Inventor, By the Inventor

Poughkeepsie, NY, United States of America

William Santiago Fernandez

USPTO Granted Patents = 13

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:

goldMedal13 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 2016-2021

where 'Filed Patents' based on already Granted Patents

13 patents (USPTO):
1. 11191154 - Enclosure with tamper respondent sensor (2021-11-30),
2. 10956623 - Enclosure with tamper respondent sensor (2021-03-23),
3. 10915463 - Synchronizing requests to access computing resources (2021-02-09),
4. 10809929 - Combined hardware/software-enforced segmentation of multi-tenant memory/storage systems (2020-10-20),
5. 10719454 - Synchronizing requests to access computing resources (2020-07-21),
6. 10586056 - Synchronizing write operations (2020-03-10),
7. 10524362 - Circuitized structure with 3-dimensional configuration (2019-12-31),
8. 10426037 - Circuitized structure with 3-dimensional configuration (2019-09-24),
9. 10360393 - Synchronizing write operations (2019-07-23),
10. 10108569 - Arbitration in an SRIOV environment (2018-10-23),
11. 10102165 - Arbitration in an SRIOV environment (2018-10-16),
12. 9535656 - Pipelined modular reduction and division (2017-01-03),
13. 9471276 - Pipelined modular reduction and division (2016-10-18),

Title: Innovative Contributions of William Santiago Fernandez

Introduction

William Santiago Fernandez, a prominent inventor based in Poughkeepsie, NY, has made significant strides in technology with a total of 13 patents to his name. His work primarily focuses on advanced electronic components and innovative assembly methods, showcasing his commitment to innovation in the tech industry.

Latest Patents

Fernandez’s latest inventions include two notable patents for an enclosure with a tamper respondent sensor. The first patent discusses a method of fabricating a tamper respondent assembly, which features an electronic component partially enclosed by a specialized enclosure. This assembly integrates a piezoelectric sensor, which is cleverly designed with plural nanorods that enhance its sensitivity. The detailed fabrication method involves constructing a base with a first conductive layer and layering piezoelectric and conductive materials to provide sensing circuitry for monitoring signals.

The second patent expands upon this concept by presenting a fully enclosed electronic component within a tamper respondent assembly. This innovative design incorporates a printed circuit board, crafted through 3D printing technology. The printed board encompasses embedded detection and signal lines that are crucial for detecting tampering events, ensuring robust security for electronic devices.

Career Highlights

William Santiago Fernandez’s innovative journey is prominently associated with his tenure at IBM (International Business Machines Corporation). His dedication to advancing electronic components has positioned him as a leader in his field. His contributions are not only limited to patents, but he also plays a pivotal role in pushing technological boundaries within the organization.

Collaborations

During his impressive career, Fernandez has collaborated with notable peers, including Silvio Dragone and Nihad Hadzic. These partnerships have fostered a collaborative environment that aims to drive technological advancements and ensure the integration of innovative solutions within the industry.

Conclusion

William Santiago Fernandez exemplifies the spirit of innovation through his remarkable work in technology and patent development. His inventions, particularly the tamper respondent sensor assemblies, highlight his ability to address modern security challenges in electronic components. As he continues to push the boundaries of technology, Fernandez stands as an inspiring figure for inventors and innovators alike.

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