The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2019

Filed:

Jun. 28, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Silvio Dragone, Winterthur, CH;

Stefano S. Oggioni, Milan, IT;

William Santiago Fernandez, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0014 (2013.01); H05K 1/0203 (2013.01); H05K 1/0275 (2013.01); H05K 1/0284 (2013.01); H05K 1/181 (2013.01); H05K 3/0011 (2013.01); H05K 3/02 (2013.01); H05K 2201/10037 (2013.01); H05K 2203/1305 (2013.01); Y10T 29/49126 (2015.01);
Abstract

A circuitized structure with a 3-dimensional configuration. A base structure is provided that includes an insulating substrate of electrically insulating material with a flat configuration, and further includes an electric circuit including at least one layer of electrically conductive material arranged on the insulating substrate. The insulating material includes a thermosetting material being partially cured by stopping a cure thereof at a B-stage before reaching a gel point. The base structure is formed according to the 3-dimensional configuration, and the cure of the thermosetting material is completed.


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