The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Jun. 13, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Silvio Dragone, Olten, CH;

Michael Fisher, Poughkeepsie, NY (US);

William Santiago Fernandez, Poughkeepsie, NY (US);

Ryan Elsasser, Poughkeepsie, NY (US);

James Busby, New Paltz, NY (US);

John R. Dangler, Rochester, MN (US);

William L. Brodsky, Binghamton, NY (US);

David C. Long, Wappingers Falls, NY (US);

Stefano S. Oggioni, Besana in Brianza, IT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 21/87 (2013.01); H01L 41/04 (2006.01); H01L 41/047 (2006.01); H01L 41/37 (2013.01); H01L 41/113 (2006.01); H01L 41/18 (2006.01); H01L 41/23 (2013.01); H01L 41/053 (2006.01);
U.S. Cl.
CPC ...
G06F 21/87 (2013.01); H01L 41/042 (2013.01); H01L 41/0475 (2013.01); H01L 41/053 (2013.01); H01L 41/1132 (2013.01); H01L 41/183 (2013.01); H01L 41/23 (2013.01); H01L 41/37 (2013.01);
Abstract

The present invention relates to a method to fabricate a tamper respondent assembly. The tamper respondent assembly includes an electronic component and an enclosure fully enclosing the electronic component. The method includes printing, by a 3-dimensional printer, a printed circuit board that forms a bottom part of the enclosure and includes a first set of embedded detection lines for detecting tampering events and signal lines for transferring signals between the electronic component and an external device. The electronic component is assembled on the printed circuit board, and a cover part of the enclosure is printed on the printed circuit board. The cover part includes a second set of embedded detection lines. Sensing circuitry can be provided for sensing the conductance of the first set of embedded detection lines and the second set of embedded detection lines to detect tampering events.


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