Mendham, NJ, United States of America

William R Lambert


Average Co-Inventor Count = 4.5

ph-index = 3

Forward Citations = 171(Granted Patents)


Location History:

  • Mendham, NJ (US) (1989 - 1990)
  • Mendham Township, Morris County, NJ (US) (1994)

Company Filing History:


Years Active: 1989-1994

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3 patents (USPTO):Explore Patents

Title: The Innovations of William R. Lambert

Introduction

William R. Lambert is a notable inventor based in Mendham, NJ, with a significant contribution to the field of electrical engineering. He holds three patents that showcase his innovative approach to electrical interconnections and circuit board technology. His work has been influential in advancing the capabilities of electronic devices.

Latest Patents

One of Lambert's latest patents is for a high-density connector for stacked circuit boards. This invention discloses a device for electrically coupling stacked circuit boards using conductive polymer interconnect material and a spacer element. In one embodiment, coaxial connection is provided by means of an array of wires within undulating metal envelopes. In another embodiment, pins are provided within holes in a plastic spacer. A third embodiment features wires laid on a substrate, with successive laminations built up to form the spacer element. Lastly, in a fourth embodiment, wire arrays are extrusion molded within thermoplastic sheets that are laminated to form the spacer element.

Another significant patent by Lambert is a composite electrical interconnection medium comprising a conductive material. This medium is made as a composite of electrically conducting, magnetic particles in a nonconductive matrix material. The particles are magnetically aligned into a network that extends in at least two dimensions, such as in a sheet or layer medium. This layer medium may further include additional, larger conductive particles that are magnetically aligned into columns extending the thickness of the medium. Typically, in this case, the medium serves as an anisotropically conductive medium in the direction of the columns, with slight in-plane conductivity imparted by the network aiding the dissipation of electrostatic charge.

Career Highlights

William R. Lambert has had a distinguished career, working with prominent companies such as AT&T Bell Laboratories and American Telephone & Telegraph Company. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in telecommunications and electrical engineering.

Collaborations

Throughout his career, Lambert has collaborated with notable colleagues, including Kaushik S. Akkapeddi and Rocco Bonanni. These collaborations have likely enriched his work and led to further innovations in the field.

Conclusion

William R. Lambert's contributions to electrical engineering through his patents and career achievements highlight his role as a significant inventor. His innovative solutions for electrical interconnections continue to impact the industry positively.

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