At&t Bell Laboratories

American Telephone & Telegraph Co., At&t Bell Laboratories

American Telephone and Telegraph, Co.

William R Lambert

Sungho Jin

Michael Gregory German

Thomas H Tiefel

Richard C Sherwood

John J Mottine, Jr

Ray D Rust

Rocco Bonanni

Neng-Hsing Lu

Kaushik S Akkapeddi

Robert J Gashler

Robert C Moore

Eugene C Schramm

Disclosed is a device for electrically coupling stocked circuit boards using conductive polymer interconnect material and a spacer element. In one embodiment, coaxial connection is provided by means of an array of wires within undulating metal envelopes. In another embodiment, pins are provided within holes in a plastic spacer. In a third embodiment, wires are laid on a substrate and successive laminations are built up to form the spacer element. In a fourth embodiment, wire arrays are extrusion molded within thermoplastic sheets which are laminated to form the spacer element.

High density connector for stacked circuit boards

An electrical interconnection medium is made as a composite of electrically conducting, magnetic particles in a nonconductive matrix material. Particles are magnetically aligned into a network which extends in at least two dimensions as, e.g., in a sheet or layer medium. A layer medium may further include additional, larger conductive particles which may be magnetically aligned into columns extending the thickness of the medium; typically, in this case, the medium serves as an anisotropically conductive medium in the direction of the columns, with slight in-plane conductivity imparted by the network aiding the dissipation of electrostatic charge.

Composite electrical interconnection medium comprising a conductive

Disclosed is a method of fabricating conductive polymer interconnect (CPI) material which employs chains of electrically conductive particles within an elastomeric matrix. Contact resistance is improved by removing a thin layer is elastomeric material which remains after normal processing. The surface layer is removed by plasma etching so that the conductive particles protrude at both surfaces. The protruding particles can be plated to replace any conductive material removed by the etch.

Fabrication of CPI layers

Growing community of inventors

Mendham, NJ, United States of America

William R Lambert