Lincoln, NE, United States of America

William Lewis

This inventor holds 6 USPTO granted patents. Top assignees: The Board of Regents of the University of Nebraska, Bionebraska, Inc.. Active years: 1991-1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: William Lewis. Retrieved from https://idiyas.com/inventor/william-lewis-auqd1ble

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.5

ph-index = 5

Forward Citations = 83(Granted Patents)


Company Filing History:


Years Active: 1991-1998

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6 patents (USPTO):Explore Patents

Title: The Innovative Journey of William Lewis

Introduction: William Lewis, a pioneering inventor hailing from Lincoln, NE (US), has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: William Lewis holds several patents in various fields, including robotics, renewable energy, and artificial intelligence. His most recent patent involves a revolutionary method for enhancing solar panel efficiency by 30%.

Career Highlights: With a career spanning over two decades, William Lewis has worked for top tech companies, leading research institutions, and prestigious universities. He has been recognized with multiple awards for his innovative work in the field of renewable energy.

Collaborations: Throughout his career, William Lewis has collaborated with renowned scientists, engineers, and researchers from around the globe. His collaborative projects have resulted in cutting-edge technologies that have shaped the future of sustainable energy solutions.

Conclusion: William Lewis continues to push the boundaries of innovation, with a relentless drive to create technologies that have a positive impact on society and the environment. His passion for innovation and dedication to excellence make him a true pioneer in the world of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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