Longmont, CO, United States of America

William Leon Rugg

USPTO Granted Patents = 11 

Average Co-Inventor Count = 1.9

ph-index = 4

Forward Citations = 55(Granted Patents)


Company Filing History:


Years Active: 2003-2017

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11 patents (USPTO):Explore Patents

Title: Innovations of William Leon Rugg

Introduction

William Leon Rugg is a notable inventor based in Longmont, CO (US), recognized for his contributions to technology and engineering. He holds a total of 11 patents, showcasing his innovative spirit and technical expertise. His work primarily focuses on enhancing device performance and efficiency through advanced thermal management solutions.

Latest Patents

Among his latest patents, Rugg has developed an apparatus for dissipating heat during the operation of a device. This invention involves a thermally conductive plate positioned between two heat sources, utilizing a thermal interface layer with higher thermal conductivity to effectively transfer heat. Additionally, he has created a multi-device storage enclosure with extendable device support sleds. This apparatus allows for the retraction and extension of operational processing devices within an enclosed housing, facilitating better access and organization of technology.

Career Highlights

William Leon Rugg is currently employed at Seagate Technology Incorporated, where he continues to innovate and contribute to the field of technology. His work at Seagate has positioned him as a key player in developing solutions that address critical challenges in device operation and efficiency.

Collaborations

Rugg has collaborated with talented individuals such as Todd Warren Kube and Anthony John Pronozuk, further enhancing the innovative environment at Seagate Technology. These collaborations have led to the development of cutting-edge technologies that benefit the industry.

Conclusion

William Leon Rugg's contributions to technology through his patents and collaborative efforts highlight his significant role as an inventor. His work continues to influence advancements in device performance and thermal management solutions.

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