Seagate Technology Incorporated

William Leon Rugg

Anthony John Pronozuk

James Edward Dykes

Shawn Jacob Noland

Todd Warren Kube

Nicholas Carl Seroff

Alexander Wei Chang

Chau Chin Low

Michael Henry Lennard

Bruce Lynn Blakeslee

Lucas KongYaw Lee

Ernest Paul Lee

Gabriel Ibarra

William B S Koh

Jui Whatt Tan

BengKit Kuah

SaiPo Yuen

Apparatus for dissipating heat during the operation of a device. In accordance with some embodiments, the apparatus compares spaced-apart first and second heat sources. A thermally conductive plate is disposed between the first and second heat sources. A thermal interface layer is contactingly disposed between the plate and the first heat source, and has a relatively higher thermal conductivity so that heat generated by the first heat source passes through the thermal interface layer and to the plate. A thermal barrier layer is contactingly disposed between the plate and the second heat source to mechanically support the plate relative to the second heat source. The thermal barrier layer has a relatively lower thermal conductivity to thermally isolate the conductive plate from the second heat source.

Dissipating heat during device operation

Apparatus for retracting and extending sets of operational processing devices in a multi-device enclosure. In accordance with some embodiments, an enclosed housing is provided with opposing first and second ends. Sleds are individually movable between a retracted position within the enclosed housing and an extended position in which the sled projects from the first end. Each sled supports a group of processing devices. A control board is disposed within the enclosed housing adjacent the second end. A plurality of flex circuits contactingly engage the processing devices to provide communication paths between the processing devices and the control board in both the retracted and extended positions of the sleds.

Multi-device storage enclosure with extendable device support sleds

Apparatus and method for maintaining processing devices at a nominally common temperature, such as but not limited to storage devices in a multi-device networked storage enclosure. In accordance with some embodiments, an enclosed housing has a first side adjacent a cold zone with a lower ambient temperature and an opposing second side adjacent a warm zone with a higher ambient temperature. First and second processing devices are arranged within the enclosed housing so that the first processing device is adjacent the cold zone and the second processing device is adjacent the warm zone. First and second thermal interface material (TIM) modules are contactingly affixed to the first and second devices and are provided with different heat conductivities so that the first and second devices are maintained at a nominally common operational temperature.

Maintaining thermal uniformity among devices in a multi-device enclosure

The present disclosure relates to assessing coverage of a connection joint, such as a solder joint, between a device and a printed circuit board (PCB). In accordance with various embodiments, a PCB includes a conductive thermal pad adapted to be electrically and mechanically connected to an exposed pad of a component by an intervening connection joint to establish a thermal path to dissipate thermal energy from the component. An isolated test via that extends through the conductive thermal pad in non-contacting relation thereto, the test via adapted to mechanically and electrically contact said intervening connection joint. A coverage characteristic of the intervening connection joint can be determined in relation to application of an electrical signal to the test via.

Assessing connection joint coverage between a device and a printed circuit board

A data storage device comprises a data storage medium and a connector that provides an interface between the data storage medium and a host device. The connector has a shape that substantially conforms to an internal storage interconnect standard. The connector comprises a first set of electrical contacts that substantially conform to the internal storage interconnect standard, and a second set of contacts configured to provide connectivity with the host device in accordance with an external storage interconnect standard. Also described are cables for connecting the data storage device to a host via the external storage interconnect standard as well as an interconnect detector.

Data storage device compatible with multiple interconnect standards

A data storage device comprises a data storage medium; an interface between the data storage medium and a host device configured to provide connectivity according to a plurality of storage interconnect standards. The data storage device also includes a interconnect detector configured to determine the presence of a physical connection to the host device and identify an interconnect standard of the host device, wherein the interconnect standard of the host device is one of the plurality of storage interconnect standards; and a controller configured to: receive an indication of the interconnect standard of the physical connection from the interconnect detector, receive data access commands in accordance with the interconnect standard from the host device via the connector; process the data access commands by accessing the data storage medium; and send a response to the data access commands in accordance with the interconnect standard to the host via the connector.

A disc drive has actuator servo-controls and signal processing electronics positioned on, and electrically connected to, a flex printed circuit board positioned on a top surface of a base along with the actuator assembly and the spindle motor of the disc drive. A power combo chip is also positioned on the flex printed circuit board that is positioned on the top surface of the base. A top cover is attached to the base to form an enclosed space. The actuator assembly and the spindle motor are within the enclosed space and the actuator servo-controls and signal processing electronics are outside the enclosed space.

Disc drive apparatus having drive electronics top mounted on flexible printed circuit board

A multi-chip package for a computer disc drive. In a preferred embodiment, the multi-chip package (MCP) includes a first die having a buffer function thereon, such as an SDRAM device, and a second die including a channel function and a controller function thereon. The two die are packaged in a single package for placement on a printed circuit board of the disc drive.

Multi function package

An actuator assembly includes a rotatable actuator arm mounted on the base of a disc drive. The actuator arm includes a metallic member seated on a non-metallic body. A proximal end of a load beam is mounted on the actuator arm and a distal end of the load beam supports a head. The actuator assembly also includes a connection between the metallic member and the load beam that secures the load beam to the actuator arm.

Load beam attachment to actuator arm

A method and system are disclosed for protecting an electrical component from electrostatic discharge prior to its electrical connection to an additional component. Specifically, a flex on suspension circuit of a disc drive that is electrically connected to the read/write head is disclosed as having exposed leads for connection to a printed circuit cable assembly. The exposed leads are shunted with a solder conductor such as solder tape after testing of the circuit and head to prevent electrostatic build-up across the read and write elements. The flex on suspension circuit is then electrically connected to the printed circuit assembly cable by reflowing the solder conductor to bond the exposed leads of the flex on suspension circuit to the electrical contacts of the printed circuit assembly cable and also to remove the electrical short established between the exposed leads by the solder conductor.

Growing community of inventors

Longmont, CO, United States of America

William Leon Rugg