The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2014
Filed:
Oct. 27, 2010
Bengkit Kuah, Singapore, SG;
Lucas Kongyaw Lee, Singapore, SG;
William L. Rugg, Longmont, CO (US);
Saipo Yuen, Singapore, SG;
William B S Koh, Singapore, SG;
Jui Whatt Tan, Singapore, SG;
BengKit Kuah, Singapore, SG;
Lucas KongYaw Lee, Singapore, SG;
William L. Rugg, Longmont, CO (US);
SaiPo Yuen, Singapore, SG;
William B S Koh, Singapore, SG;
Jui Whatt Tan, Singapore, SG;
Seagate Technology LLC, Scotts Valley, CA (US);
Abstract
The present disclosure relates to assessing coverage of a connection joint, such as a solder joint, between a device and a printed circuit board (PCB). In accordance with various embodiments, a PCB includes a conductive thermal pad adapted to be electrically and mechanically connected to an exposed pad of a component by an intervening connection joint to establish a thermal path to dissipate thermal energy from the component. An isolated test via that extends through the conductive thermal pad in non-contacting relation thereto, the test via adapted to mechanically and electrically contact said intervening connection joint. A coverage characteristic of the intervening connection joint can be determined in relation to application of an electrical signal to the test via.