William L Lehner

Title: The Innovations of William L. Lehner

Introduction

William L. Lehner is a notable inventor based in Los Altos Hills, California. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to advancements that enhance the reliability and cost-effectiveness of semiconductor devices.

Latest Patents

William L. Lehner holds a patent for a two-part package for a semiconductor die. This patent describes a method where semiconductor devices containing integrated circuits are attached directly to external package leads. The process involves pressing multiple groups of leads against bonding pads on face-up semiconductor dice and heating the composite structures. The solder bumps on the bonding pads contain hard pedestals that prevent the leads from being pushed into the semiconductor devices. This innovative method significantly lowers the cost of each packaged semiconductor device while improving reliability compared to prior art structures. He has 1 patent to his name.

Career Highlights

Lehner has had a distinguished career, working at Signetics, a company known for its advancements in semiconductor technology. His work has been instrumental in developing more efficient packaging methods for semiconductor devices.

Collaborations

Throughout his career, William L. Lehner has collaborated with notable colleagues, including Edward F. Duffek and Ernest J. Funk. These collaborations have contributed to the advancement of semiconductor technology and innovation.

Conclusion

William L. Lehner's contributions to semiconductor technology through his innovative patent have made a lasting impact on the industry. His work continues to influence the development of reliable and cost-effective semiconductor devices.