William J Holdgrafer

Title: The Innovations of William J Holdgrafer

Introduction

William J Holdgrafer is a notable inventor based in Burlington, NJ (US). He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work primarily focuses on methods that enhance the efficiency and accuracy of wire bonding processes in semiconductor devices.

Latest Patents

One of his latest patents is titled "Method of making constant clearance flat link fine wire interconnections." This innovative method involves pre-forming a length of fine wire while simultaneously creating a fine wire interconnection between two bonding points on a semiconductor device. The process includes teaching the location of the edges of the die and establishing a plane in space that is positioned away from the edges of the die. By determining the height of the clearance above the die and the XYZ location of the bonding points, the automatic wire bonder is directed to generate a desired geometric link profile, which defines the lengths of links L1, L2, and L3. This method allows for precise calculations of tool trajectories for pre-forming fine wire interconnections.

Another significant patent by Holdgrafer is the "Method of centering bond positions." This method aims to increase accuracy and reduce the time required to teach target bonding points on a reference semiconductor device and its associated lead frame. It involves manually locating a first target bonding point and utilizing a pattern recognition system (PRS) of an automatic wire bonder to automatically relocate the exact center of the preferred target bonding point. The PRS is programmed to find or relocate bonding points at the exact center of leads or pads, enhancing the efficiency of the bonding process during production.

Career Highlights

Throughout his career, William J Holdgrafer has worked with prominent companies in the semiconductor industry, including Kulicke and Soffa Industries, Inc. and Kulicke and Soffa Investments, Inc. His expertise in wire bonding technology has made him a valuable asset in these organizations.

Collaborations

Holdgrafer has collaborated with notable professionals in the field, including Lee R Levine and Douglas L Gauntt. These collaborations have contributed to the advancement of semiconductor technology and the development of innovative bonding methods.

Conclusion

William J Holdgrafer's contributions to the semiconductor industry through his patents and innovative methods have significantly impacted the efficiency of wire bonding processes. His work continues to influence advancements in semiconductor technology