Kulicke and Soffa Industries, Inc.

Kulicke and Soffa Investments, Inc.

William J Holdgrafer

Lee R Levine

Douglas L Gauntt

Michael J Sheaffer

Robert B Newsome

A method of pre-forming a length of fine wire while simultaneously making a fire wire interconnection between a first and a second bonding point on a semiconductor device includes the steps of teaching the location of the edges of the die and teaching a plane in space which is located away from the edges of said die. After teaching the height of the clearance above the die and the XYZ location of the first and second bonding points the automatic wire bonder in directed to generate a desired geometric link profile between bonding points which defines the length of links L1, L2 and L3. Using the geometric profile and empirically determined constants the automatic wire bonder calculates a tool trajectory for pre-forming the fine wire while simultaneously making a fine wire interconnection with an automatic wire bonder.

Method of making constant clearance flat link fine wire interconnections

A method for increasing accuracy and reducing the time required to teach the target bonding points on a reference semiconductor device and its associated lead frame comprises manually approximately locating at least a first target bonding point and at each approximately located bonding point causing the pattern recognition system (PRS) of an automatic wire bonder to relocate the exact center of preferred target bonding point automatically. The direction and approximate distance to the next point is programmed into the PRS to enable the PRS to automatically step to the next approximate location of a next bonding point or a pad or a lead. At each pad or lead the PRS is programmed to find or relocate this bonding point at the exact center or preferred target bonding point on the lead or pad. It is possible to program such automatic teach operations on pads or leads over a complete semiconductor or preferably over a plurality of pads or leads arranged in continuing direction and spaced from each other by a predetermined pitch. During bonding of production semiconductor devices the taught bonding points are employed as approximate bonding points which causes the PRS to again relocate the exact preferred target bonding points with reference to the PRS located edges of the pads and leads to be bonded.

Method of centering bond positions

A novel method of making very low profile fine wire interconnections is accomplished with a conventional automatic gold wire ball bonder and includes the steps of making a conventional first ball bond and moving the bonding tool so as to pay out a length of wire that is shorter than the final desired length of wire to be used in the interconnection. The bonding tool is movingly engaged against the target on which the second bond is to be made employing a first bonding force which bends and conforms the wire beneath the working face of the capillary bonding tool and simultaneously forward extrudes and wire draws the neck of the fine wire into a tapered section which avoids backward extrusion. Subsequently a second bond force and ultrasonic energy is applied at the second bond target position to generate a conventional thermosonic second bond. The fine wire is bonded to the target by a thermocompression bond resulting from the moving first bonding force and the bond is interconnected to a conventional thermosonic bond resulting from the second bond force which produces a larger and stronger bond area than a conventional prior art second bond.

Method of making low profile fine wire interconnections

Apparatus and a method of correcting for repeatable positioning errors in an X-Y table is provided. An accurate mask is provided having a plurality of repetitive recognizable patterns thereon which is placed in the field of view of a pattern recognition system of a semiconductor processing machine to be calibrated. The semiconductor processing machine is programmed to perform a series of steps which steps the X-Y table to positions which are supposedly accurate relative to a fixed point. At each of the stepped points, the plurality of repetitive recognizable patterns on the mask are electronically scanned by the pattern recognition system and the deviation of the position of the pattern relative to the desired position is calculated to provide X and Y deviations from the theoretical position of the X-Y table. These deviations of points along a linear X and a linear Y axis are employed to calculate the actual deviations of other pattern points for all of the possible positions of movement along other X and Y axes.

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Burlington, NJ, United States of America

William J Holdgrafer