Company Filing History:
Years Active: 1986-1996
Certainly! Here is the article about inventor William H Lawrence:
Title: Innovator Spotlight: William H Lawrence - Pioneering Advances in Electronic Circuit Packaging
Introduction: William H Lawrence, a distinguished inventor based in Greene, NY, has made significant contributions to the field of electronic circuit packaging. With a total of 7 patents to his name, Lawrence is renowned for his expertise in depositing conductive metals onto substrates and fabricating metal core layers for multi-layer circuit boards.
Latest Patents:
1. Depositing a Conductive Metal onto a Substrate: Lawrence's innovative method involves obtaining a metal sheet with specific surface parameters to effectively deposit a conductive metal onto a dielectric substrate.
2. Method for Fabricating Metal Core Layers for a Multi-Layer Circuit Board: This patent outlines a process for fabricating multilayer electronic circuit packages, utilizing a metal foil as the core layer and applying a dielectric polymer coating through various deposition techniques.
Career Highlights: Lawrence is currently employed at IBM (International Business Machines Corporation), where he continues to push the boundaries of electronic packaging technologies. His expertise and innovative solutions have significantly impacted the industry, setting new standards for efficiency and performance.
Collaborations: Throughout his career, William H Lawrence has collaborated with esteemed colleagues such as Jeffrey Donald Gelorme and Joseph Paul Kuczynski. Together, they have worked on groundbreaking projects that have reshaped the landscape of electronic circuit packaging.
Conclusion: In conclusion, William H Lawrence stands as a visionary inventor whose groundbreaking work in electronic circuit packaging has propelled the industry forward. His dedication to innovation and excellence serves as an inspiration to aspiring inventors and engineers worldwide.
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