International Business Machines Corporation

William H Lawrence

Jeffrey Donald Gelorme

Joseph Paul Kuczynski

Voya Rista Markovich

Carlos Juan Sambucetti

Logan L Simpson

Raymond W Angelo

Socrates P Pappas

Jonathan David Reid

Roy H Magnuson

Lisa Jeanine Jimarez

Peter Slota, Jr

William J Summa

Ashit A Mehta

Frederick R Christie

Gary K Lemon

Robert J Owen

Lawrence Marcel Brown

Ralph E Parsons

John M Brauer

Robert W Johnson

A method for depositing a conductive metal onto a dielectric substrate is provided. The method includes obtaining a metal sheet having a roughened surface that has the following parameters:

Depositing a conductive metal onto a substrate

Disclosed is a method of fabricating a multilayer electronic circuit package. The multilayer circuit package has at least one layer that is a circuitized, polymer encapsulated metal core. According to the method of the invention a metal foil is provided for the metal core of the layer. This metal core foil may be provided as a single unit or in a continuous, roll to roll, process. The vias and through holes are drilled, etched, or punched through the metal foil. An adhesion promoter is then applied to the perforate metal foil for subsequent adhesion of polymer to the foil. The dielectric polymer is then applied to the perforate metal foil core by vapor depositing, chemical vapor depositing, spraying or electrophoretically depositing, a thermally processable dielectric polymer or precursor thereof onto exposed surfaces of the perforate metal foil including the walls of the through holes and vias. The dielectric polymer or precursor thereof is then thermally processed to form a conformal dielectric, polymeric coating on surfaces of the perforate metal foil, including the interior surfaces of the vias and through holes. This dielectric, polymeric coating may then be circuitized, and coated with an adhesive for lamination to the next adjacent layer. After lamination, one or more chips are attached to the completed package.

Method for fabricating metal core layers for a multi-layer circuit board

Photocurable compositions with, as photoinitiator, sulfonium salts of the formula: ##STR1## wherein Ar is a fused aromatic radical; R.sub.1 is a divalent organic bridge; each R.sub.2 and R.sub.3 individually is an alkyl, aryl, alkaryl, aralkyl or substituted aryl, provided that not more than one of R.sub.2 and R.sub.3 is alkyl; and A is a non-nucleophilic anion; use thereof and preparation thereof.

Photocurable epoxy composition with sulfonium salt photoinitiator

Sulfonium salts of the formula: ##STR1## wherein Ar is a fused aromatic radical; R.sub.1 is a divalent organic bridge; each R.sub.2 and R.sub.3 individually is an alkyl, aryl, alkaryl, aralkyl or substituted aryl, provided thatn not more than one of R.sub.2 and R.sub.3 is alkyl; and A is a non-nucleophilic anion; use thereof and preparation thereof.

Sulfonium salts and use and preparation thereof

A non-conductive substrate is conditioned for subsequent selective deposition of a metal thereon by providing at least one of the major surfaces of the substrate in roughened form, contacting that surface(s) with a palladium/tin catalyst, activating the catalyst by employing an alkali hydroxide solution, laminating a photosensitive composition to the major surface(s), and exposing the photosensitive composition to actinic light in a predetermined pattern and then developing to provide the predetermined pattern.

Conditioning a non-conductive substrate for subsequent selective

Cationic curable photoresists are patterned by exposing such to a laser beam in a pattern, followed by developing.

Method for patterning cationic curable photoresist

The surface of a substrate is roughened by providing a substrate which comprises a resinous material and an inorganic particulate material; and etching a surface of the substrate to selectively etch the resinous material and thereby produce the roughened surface.

Roughening surface of a substrate

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Greene, NY, United States of America

William H Lawrence