Corvallis, OR, United States of America

William F Stickle


Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: The Innovations of William F. Stickle

Introduction

William F. Stickle is an accomplished inventor based in Corvallis, Oregon. He is known for his significant contributions to the field of materials science, particularly in the development of amorphous thin metal films. His innovative work has led to advancements that are applicable in various technological domains.

Latest Patents

William F. Stickle holds a patent for an amorphous thin metal film. This invention comprises a combination of three metals or metalloids, including 5 at % to 90 at % of a metalloid selected from the group of carbon, silicon, and boron. Additionally, it includes 5 at % to 90 at % of a first metal selected from a diverse group that includes titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, and platinum. The invention also incorporates 1 at % to 90 at % of cerium, with the three elements accounting for at least 50 at % of the amorphous thin metal film.

Career Highlights

Throughout his career, Stickle has worked with notable organizations such as Hewlett-Packard Development Company, L.P. and Oregon State University. His experience in these institutions has allowed him to collaborate with leading experts in the field and contribute to groundbreaking research.

Collaborations

Some of his notable coworkers include James Elmer Abbott, Jr. and John M. McGlone. Their collaborative efforts have further enriched the research environment and fostered innovation in their respective fields.

Conclusion

William F. Stickle's contributions to the field of materials science, particularly through his patent on amorphous thin metal films, highlight his role as a significant inventor. His work continues to influence advancements in technology and materials engineering.

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