The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Jun. 24, 2016
Hewlett-packard Development Company, L.p., Houston, TX (US);
The State of Oregon State Board of Higher Education on Behalf of Oregon State University, Corvallis, OR (US);
James Elmer Abbott, Jr., Corvallis, OR (US);
John M McGlone, Corvallis, OR (US);
Kristopher Olsen, Corvallis, OR (US);
Douglas A Keszler, Corvallis, OR (US);
John Wager, Corvallis, OR (US);
Roberto A Pugliese, Tangent, OR (US);
William F Stickle, Corvallis, OR (US);
Greg Scott Long, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Oregon State University, Corvallis, OR (US);
Abstract
An amorphous thin metal film can comprise a combination of three metals or metalloids including: 5 at % to 90 at % of a metalloid selected from the group of carbon, silicon, and boron; 5 at % to 90 at % of a first metal selected from the group of titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, and platinum; and 1 at % to 90 at % of cerium. The three elements may account for at least 50 at % of the amorphous thin metal film.