This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1988.
Company Filing History:
Years Active: 1988
Title: William F. Herrmann: Innovator in Circuit Board Technology
Introduction
William F. Herrmann is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of printed circuit board technology. His innovative approach has led to the development of a unique method for enhancing circuit board manufacturing processes.
Latest Patents
Herrmann holds a patent for a method of removing seed particles from circuit board substrate surfaces. This patent, titled "Method of removing seed particles from circuit board substrate surface," describes a process where metallic seed particles are applied to the substrate surface. An image of the desired conductor pattern is defined by a maskant layer, allowing for the electroless deposition of conductor material on the exposed seeded areas. The substrate surface is then subjected to a plasma discharge to facilitate the removal of the seed particles. This method improves the efficiency and quality of printed circuit boards.
Career Highlights
William F. Herrmann is associated with International Business Machines Corporation (IBM), where he has contributed to various projects in circuit board technology. His work has been instrumental in advancing manufacturing techniques and improving product reliability.
Collaborations
Throughout his career, Herrmann has collaborated with talented individuals such as Suryadevara Vijayakumar Babu and Joseph G. Hoffarth. These collaborations have fostered innovation and have led to the successful development of new technologies in the field.
Conclusion
William F. Herrmann's contributions to circuit board technology exemplify the spirit of innovation. His patented methods and collaborations have significantly impacted the industry, showcasing his dedication to advancing technology.