The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 1988
Filed:
Jan. 24, 1986
Applicant:
Inventors:
Suryadevara V Babu, Potsdam, NY (US);
William F Herrmann, Endicott, NY (US);
Joseph G Hoffarth, Binghamton, NY (US);
Voya Markovich, Endwell, NY (US);
Robert T Wiley, Binghamton, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ; B05D / ;
U.S. Cl.
CPC ...
156628 ; 156643 ; 156656 ; 427 98 ; 427306 ; 430314 ; 134-2 ; 134 26 ; 134 29 ;
Abstract
A method of making a printed circuit board is disclosed wherein metallic seed particles are applied to a surface of the substrate. An image of the desired conductor pattern is defined by a maskant layer to permit the subsequent electroless deposition of the conductor material upon the exposed seeded areas of the substrate. Then, the substrate surface is subjected to a plasma discharge to facilitate removal of the seed particles.